Name: XCVC1702-1MLINSVG1369
Brand: AMD
SKU: XCVC1702-1MLINSVG1369
Availability: InStock
Rating: 5 (183 reviews)

XCVC1702-1MLINSVG1369

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Numero di parte	XCVC1702-1MLINSVG1369
Produttore	AMD
Descrizione	IC VERSAL AI-CORE FPGA 1369BGA
Scheda dati
pacchetto	-
ECAD
A magazzino	0 piece(s)
Prezzo unitario	Request a Quote
Tempi di Consegna	Essere confermato
Tempo di consegna stimato	dic 27 - gen 1 (Scegli una spedizione rapida)
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Specifiche XCVC1702-1MLINSVG1369

Produttore	AMD
Categoria	Circuiti integrati (CI) - Integrato - System On Chip (SoC)
pacchetto	-
ECAD
Serie	Versal™ AI Core
Architettura	MPU, FPGA
Processore Core	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Dimensione Flash	-
Dimensione RAM	256KB
periferiche	DDR, DMA, PCIe
Connettività	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Velocità	600MHz, 1.3GHz
Attributi primari	Versal™ AI Core FPGA, 1M Logic Cells
temperatura di esercizio	-40°C ~ 110°C (TJ)
Pacchetto / caso	1369-BFBGA, FCBGA
Pacchetto dispositivo fornitore	1369-FCBGA (35x35)

XCVC1702-1MLINSVG1369 Packaging

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(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCVC1702-1MLINSVG1369.

(3)The PartNo is unused and only in the original unpacked packaging.

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(1)Inform us within 90 days

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